Environmentally safe solder. This solder is designed to replace the standard lead barring type of solder for electronic connexions. The reflow temperature is 217-219 degrees Celcius. The alloy is 95.5% Tin (Sn) / 4% Silver (Ag) / 0.5% (Cu). This combination is the best for soldering electonic connexions while retarding the dissolution of copper. It has excellent wetting and spreading properties.